Micro SIM Kaadi Asopọmọra, 6Pin H1.42mm KLS1-SIM-105
Alaye ọja Alaye Asopọ kaadi SIM Micro SIM,6Pin H1.42mm Ohun elo: Insulator:High Temperature Thermoplastic,UL 94V-0 Contact:Copper Alloy,Plated 50u”Ni Ooverall Olubasọrọ Au 1U Shell:SUS,Plated 50u”Ni Overall,Plated Contact 1u”Aual Select Electric Characteristic Area Rating:0.5mA AC/DC max
Micro SIM Kaadi CONN,6P,H1.45mm,SMD KLS1-SIM-046
Awọn aworan Ọja Alaye Alaye Ohun elo: Ile: LCP, UL94V-0 Olubasọrọ:C5210 , Filaṣi goolu Ti a bo Lori Agbegbe Olubasọrọ; Gold Flash Plating On Solder Iru; Pẹlu Entrre Olubasọrọ Underplated Nickel ikarahun:SUS304,Nickel Underplated Lori gbogbo, Gold Flash Palara Lori Solder Iru ElectricaL SpecificaTions: Lọwọlọwọ Rating: 0.5A Foliteji Rating:5V Kan si Resistance:50mΩ Max. Idaabobo idabobo: 1000MΩ Min Durabiliy: 3000 Awọn iyipo Min
Asopọmọ kaadi SIM Micro, 8Pin H1.5mm, Iru isopo KLS1-SIM-089
Awọn aworan Ọja Alaye Ọja Micro SIM Kaadi Asopọmọra,8Pin H1.5mm,Hinged Iru ohun elo Housing:Thermoplastic,UL94V-0. Ipari:Phosphor Bronze,T=0.15,Ni Palara Labẹ,Au Palara Lori Agbegbe Olubasọrọ,G/F Palara Lori Soldertail. Ikarahun: Irin Alagbara, T=0.15, Ni Palara Labẹ, G/F Palara Lori Soldertail. Itanna Olubasọrọ Resistance: 60mΩ O pọju. Idaabobo Idaabobo: 1000MΩ Min. Dielectric Withstanding Foliteji: 500V AC Fun Iṣẹju 1. Agbara: 5000 Awọn iyipo. Iwọn otutu ti nṣiṣẹ: -45ºC~+85ºC
Asopọmọ kaadi SIM Micro, 6Pin H1.8mm, Iru isopo KLS1-SIM-072
Awọn aworan Ọja Alaye Ọja Micro SIM Kaadi Asopọmọra, 6Pin H1.8mm,Hinged Iru Ohun elo: Ile: LCP, UL94V-0, Black. Ibudo: Alloy Ejò. Ikarahun: Irin alagbara. Itanna: Iwọn lọwọlọwọ: 1A Max. Iwọn Foliteji: 30V DC max. Olubasọrọ Resistance: 30mΩ O pọju. Idaabobo Idaabobo: 1000MΩ Min. Dielectric Foliteji: 500V rms/min. Agbara: 5000 Awọn iyipo. Iwọn otutu ti nṣiṣẹ: -45ºC~+85ºC
Asopọ kaadi SIM Micro, 6Pin H1.5mm, Iru atẹ KLS1-SIM-075
Alaye ọja Alaye Asopọ kaadi SIM Micro SIM, 6Pin H1.5mm, Iru atẹ ohun elo: Insulator:Hi-Temperature Plastic,UL94V-0, Black. Terminal:Copper Alloy.Gold Flash Plating on all ebute,Aad 50u” min Nickel Underplated on allover. Shell:50u” Nickel Underplated on allover,Gold filasi lori solder pad. Itanna: Rating lọwọlọwọ: 0.5A Foliteji Rating Voltage: 5.0 vrms Idabobo Resistance: 1000MΩ Min./500V DC Diduro Foliteji:250V ACrms Fun 1Minute Kan si Res...
Asopọ SIM Kaadi Micro, 6P, Titari PULL, H1.5mm KLS1-SIM-099
Alaye Awọn aworan ọja Micro SIM Kaadi Asopọmọra,6P,Titari PULL,H1.5mm Ohun elo Housing:Thermoplastic,UL94V-0. Ipari: Alloy Ejò, Wura Palara Lori Agbegbe Olubasọrọ ati Awọn iru Solder, Nickel Palara Lapapọ. Ikarahun:Stainless Steel.Nickel Palara Iwoye.GoldPlated Lori Solder Iru. Itanna: Oṣuwọn lọwọlọwọ: 1.0 A max. Olubasọrọ Resistance: 30mΩ O pọju. Dielectric Dielectric Foliteji: 500V AC Idaabobo Resistance:1000MΩ Min./500V DC Iwọn otutu Ṣiṣẹ: -45ºC~+85ºC
Asopọ kaadi SIM Micro SIM, 8P, Titari PULL, H1.5mm KLS1-SIM-091
Ọja Awọn aworan Alaye Ọja Micro SIM Kaadi Asopọmọra,8P,PUSH PULL,H1.5mm Itanna: Ti won won Lọwọlọwọ:1.0A Ti won won Foliteji:30V Olubasọrọ Resistance:50mΩ Max. Idabobo Resistance:1000MΩ Min./500V DC Dielectric Iduroṣinṣin Foliteji: 500V AC Solder abiltiy:250oC ~%% P5oC,10%% P0.5s Agbara:5000 Awọn iyipo Min. Olubasọrọ Resistance: 50mΩ O pọju. Iwọn otutu ti nṣiṣẹ: -45ºC~+85ºC
Micro SIM Kaadi Asopọ, 6P
Awọn aworan ọja
Micro SIM Kaadi Asopọ, 6P
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Micro SIM Kaadi Asopọmọra,8P
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Micro SIM Kaadi Asopọmọra,8P
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Micro SIM Kaadi Asopọmọra,8P
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Micro SIM Kaadi Asopọ, 6P
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Asopọmọ kaadi SIM Micro;Titari PUSH,6P+1P Tabi 8P+1P,H1.50mm KLS1-SIM-090
Alaye Awọn aworan Ọja Asopọmọra Kaadi SIM Micro;PUSH PUSH,6P+1P Tabi 8P+1P,H1.50mm Electrical Rating lọwọlọwọ: 0.5A Voltage Rating:5.0 vrms Olubasọrọ resistance:100mΩ Max. Idaabobo idabobo: 1000M Min. Ifarada Foliteji: 250V ACrms Fun Iṣẹju 1. Ṣiṣẹ TempRange:-45℃-+105℃ Ohun elo: Insulator:Hi-Temperature plastic,UL94V-0,Black Terminal:Copper Alloy,Gold Flash Plating On All Terminal,Ati 50u"min nickel underplated on allover. Ikarahun: Irin Alagbara, 50u &...
Asopọmọ kaadi SIM Micro SIM;PUSH PUSH,6P Tabi 6P+1P,H1.35mm KLS1-SIM-069
Alaye Awọn aworan ọja Micro SIM Asopọ kaadi SIM;PUSH PUSH,6P Tabi 6P+1P,H1.35mm,Laisi ifiweranṣẹ. Ohun elo: Insulator:High Temperature Thermoplastic,UL94V-0 Contact:Copper Alloy,Plated 50U”Ni Iwoye Olubasọrọ Au 1U Shell:SUS,Plated 50U”Ni ìwò Palara 1u”Agbegbe Olubasọrọ Itanna: Rating lọwọlọwọ: 0.5A Max. Voltage ACting: Max. Idabobo Resistance:1000M Min./500VDC Ọriniinitutu Ibiti: 95% RH Max.
Asopọ kaadi SIM Micro SIM 8P, Titari PULL, H2.4mm KLS1-SIM-044-8P
Ọja Awọn aworan Alaye Ọja Micro SIM Kaadi Asopọmọra 8P, PUSH PULL, H2.4mm Ohun elo: Mimọ: Hi-Temp Thermoplastic, UL94V-0.Black. Olubasọrọ data: Alloy Ejò, Gold Palara. Ikarahun: Irin alagbara, Ti a fi wura ṣe. Itanna: Olubasọrọ Resistance:50mΩ aṣoju,100Ω O pọju. Idabobo Resistance:>1000MΩ/500V DC. 3.Solderability Vapor alakoso:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Tita afọwọṣe:370ºC.3sec.Max. Iwọn otutu ti nṣiṣẹ: -45ºC~+105ºC
Asopọ kaadi SIM Micro SIM 6P, Titari PULL, H2.4mm KLS1-SIM-044-6P
Ọja Awọn aworan Alaye Ọja Micro SIM Kaadi Asopọmọra 6P, PUSH PULL, H2.4mm Ohun elo: Mimọ: Hi-Temp Thermoplastic, UL94V-0.Black. Olubasọrọ data: Alloy Ejò, Gold Palara. Ikarahun: Irin alagbara, Ti a fi wura ṣe. Itanna: Olubasọrọ Resistance:50mΩ aṣoju,100Ω O pọju. Idabobo Resistance:>1000MΩ/500V DC. 3.Solderability Vapor alakoso:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Tita afọwọṣe:370ºC.3sec.Max. Iwọn otutu ti nṣiṣẹ: -45ºC~+105ºC
Asopọ kaadi SIM;PUSH PUSH,6P+2P,H1.80mm,Pẹlu ifiweranṣẹ tabi Laisi ifiweranṣẹ. KLS1-SIM-110
Awọn aworan Ọja Alaye Ọja Asopọ kaadi SIM;PUSH PUSH,6P+2P,H1.80mm Pẹlu ifiweranṣẹ tabi Laisi ifiweranṣẹ. Ohun elo: Ohun elo Ile: LCP UL94V-0 Ohun elo Olubasọrọ: Tin-Bronze Package: Teepu ati Reel Package Electric Awọn ẹya ara ẹrọ: Iwọn foliteji: 100V AC Rating lọwọlọwọ: 0.5A Max resistance foliteji: 250V AC / 1Minute Insulation resistance: 00Υ: Υ ≤30mΩ Igbesi aye: 5000 Awọn iyipo Ṣiṣẹ ni iwọn otutu: -45ºC~+85ºC
Asopọ kaadi SIM, PUSH PUSH, 8P+1P, H1.9mm, pẹlu Ifiweranṣẹ KLS1-SIM-108
Awọn aworan Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 8P + 1P, H1.9mm, pẹlu Ohun elo Ifiweranṣẹ: Ile: Hi-Temp Plastic, UL94V-0.Rated. Olubasọrọ: Alloy Ejò. Ikarahun: Alloy Ejò. Pipa: Agbegbe Olubasọrọ: Filaṣi goolu. Agbegbe solder: 80u "min, Matte tin alloy plated. Labẹ awo: 30u" min, Nickel. Shell:30u” min,Nickel plated ìwò Solder area:Gole filasi
Asopọ kaadi SIM, PUSH PUSH, 6P+1P, H1.9mm, pẹlu Ifiweranṣẹ KLS1-SIM-107
Awọn aworan Ọja Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 6P + 1P, H1.9mm, pẹlu Ohun elo Ifiweranṣẹ: Ile: Hi-Temp Plastic, UL94V-0.Rated. Olubasọrọ: Alloy Ejò. Ikarahun: Ejò Alloy/Irin. Pipa: Agbegbe Olubasọrọ: Filaṣi goolu. Agbegbe solder: 80u "min, Matte tin alloy plated. Labẹ awo: 30u" min, Nickel. Shell:30u” min,Nickel plated ìwò Solder area:Gole filasi
Asopọ kaadi SIM;PUSH PUSH,6P,H1.85mm KLS1-SIM-106
Awọn aworan Ọja Alaye Ọja Asopọ kaadi SIM, PUSH PUSH,6P,H1.85mm,pẹlu Ile ifiweranṣẹ:Hi-Temp Plastic,UL94V-0.Rated. Olubasọrọ: Alloy Ejò. Ikarahun: SUS. Ipari: Ti ṣe awo goolu lori agbegbe conatct, Tin ti a fi si ori awọn iru ti o ta.
Asopọ kaadi SIM, PUSH PUSH, 6P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-087
Awọn aworan Ọja Alaye Ọja Asopọ kaadi SIM, PUSH PUSH,6P,H1.85mm,laisi Ohun elo Ifiweranṣẹ: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò, T = 0.15mm Shell: Irin Alagbara, T = 0.15mm Pari: Terminal: 50u” min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u”Nickel Underplated on Allover,Gold Flash on Solder Latch. Itanna: Rating lọwọlọwọ: 0.5A. Iwọn foliteji: 5.0 Vrms. Idabobo Resistance: 500...
Asopọ kaadi SIM, PUSH PUSH, 6P+2P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-086
Awọn aworan Ọja Alaye Ọja Asopọ kaadi SIM,PUSH PUSH,6P+2P,H1.85mm,laisi Ohun elo Ifiweranṣẹ: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò, T = 0.15mm Shell: Irin Alagbara, T = 0.15mm Pari: Terminal: 50u” min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u”Nickel Underplated on Allover,Gold Flash on Solder Latch. Itanna: Rating lọwọlọwọ: 0.5A. Iwọn foliteji: 5.0 Vrms. Resistance Insulation:...
Asopọ kaadi SIM, PUSH PUSH, 8P+2P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-085A
Awọn aworan Ọja Alaye Ọja Asopọ kaadi SIM,PUSH PUSH,8P+2P,H1.85mm,laisi Ohun elo Ifiweranṣẹ: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò, T = 0.15mm Shell: Irin Alagbara, T = 0.15mm Pari: Terminal: 50u” min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u” min Tin on Solder Tail. Shell:50u”Nickel Underplated on Allover,Gold Flash on Solder Latch. Itanna: Rating lọwọlọwọ: 0.5A. Iwọn foliteji: 5.0 Vrms. Resistance Insulation...- English
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