Asopọ kaadi SIM, PUSH PUSH, 8P+1P, H1.9mm, pẹlu Ifiweranṣẹ KLS1-SIM-108

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Asopọ kaadi SIM, PUSH PUSH, 8P+1P, H1.9mm, pẹlu Ifiweranṣẹ

Ohun elo:

Ibugbe: Hi-Temp Plastic, UL94V-0.Ti won won.

Olubasọrọ: Alloy Ejò.

Ikarahun: Alloy Ejò.

Pipade:

Agbegbe Olubasọrọ: Filaṣi goolu.

Agbegbe solder:80u” min, Matte tin alloy palara.

Labẹ awo:30u” min,Nickel.

Ikarahun: 30u” min, Nickel palara lapapọ
Agbegbe solder:Gole filasi.

Itanna:

Oṣuwọn lọwọlọwọ: 0.5A.

Ifarada Foliteji: AC500V rms

Idaabobo Idaabobo: 1000MΩMin, Ni DC 500V

Olubasọrọ Resistance:100mΩ O pọju.

Awọn iyipo ibarasun: Awọn ifibọ 3000.

Iwọn otutu ti nṣiṣẹ: -45ºC~+85ºC

Ti tẹlẹ: Asopọ kaadi SIM, PUSH PUSH, 6P+1P, H1.9mm, pẹlu Ifiweranṣẹ KLS1-SIM-107

Itele: Asopọ kaadi SIM;PUSH PUSH,6P+2P,H1.80mm,Pẹlu ifiweranṣẹ tabi Laisi ifiweranṣẹ.KLS1-SIM-110