Micro SIM Kaadi Asopọmọra,8P
Micro SIM Kaadi Asopọmọra,8P
Micro SIM Kaadi Asopọ, 6P
P-H1.5-R )
Asopọmọ kaadi SIM Micro;Titari PUSH,6P+1P Tabi 8P+1P,H1.50mm KLS1-SIM-090
Asopọmọ kaadi SIM Micro SIM;PUSH PUSH,6P Tabi 6P+1P,H1.35mm KLS1-SIM-069
Alaye ọja Micro SIM Asopọ kaadi SIM;PUSH PUSH,6P Tabi 6P+1P,H1.35mm,Laisi ifiweranṣẹ. Ohun elo: Insulator: High TemperatureThermoplastic,UL94V-0 Olubasọrọ:Ejò Alloy,Plated 50U"NiOverall Contact Au 1U Shell:SUS,Plated 50U"Ni ìwò Palated 1u"Au Yiyan Olubasọrọ Area Electrical: Lọwọlọwọ Rating: 0.5AApalararẹ 0DC Max. Idabobo Resistance:1000M Min./500VDC Ibaramu ọriniinitutu Ibiti: 95% RH Ma...
Asopọ kaadi SIM Micro SIM 8P, Titari PULL, H2.4mm KLS1-SIM-044-8P
Alaye ọja Micro SIM Kaadi Asopọ 8P, PUSH PULL, H2.4mm Ohun elo: Mimọ: Hi-Temp Thermoplastic, UL94V-0.Black. Olubasọrọ data: Alloy Ejò, Gold Palara. Ikarahun: Irin alagbara, Ti a fi wura ṣe. Itanna: Olubasọrọ Resistance:50mΩ aṣoju,100Ω O pọju. Idabobo Resistance:>1000MΩ/500V DC. 3.Solderability Vapor alakoso:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Tita afọwọṣe:370ºC.3sec.Max. Iwọn otutu ti nṣiṣẹ: -45ºC~+105&o...
Asopọ kaadi SIM Micro SIM 6P, Titari PULL, H2.4mm KLS1-SIM-044-6P
Alaye ọja Micro SIM Kaadi Asopọ 6P, PUSH PULL, H2.4mm Ohun elo: Mimọ: Hi-Temp Thermoplastic, UL94V-0.Black. Olubasọrọ data: Alloy Ejò, Gold Palara. Ikarahun: Irin alagbara, Ti a fi wura ṣe. Itanna: Olubasọrọ Resistance:50mΩ aṣoju,100Ω O pọju. Idabobo Resistance:>1000MΩ/500V DC. 3.Solderability Vapor alakoso:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Tita afọwọṣe:370ºC.3sec.Max. Iwọn otutu ti nṣiṣẹ: -45ºC~+105&o...
Asopọ kaadi SIM;PUSH PUSH,6P+2P,H1.80mm,Pẹlu ifiweranṣẹ tabi Laisi ifiweranṣẹ. KLS1-SIM-110
Alaye Ọja Asopọ kaadi SIM;PUSH PUSH,6P + 2P,H1.80mm Pẹlu ifiweranṣẹ tabi Laisi ifiweranṣẹ.Material: Ohun elo Ile: LCP UL94V-0Ohun elo Olubasọrọ: Tin-BronzePackage: Teepu ati Reel PackageElectrical Characteristics:Voltage Rating: 1005D foliteji: 250V AC/1MinuteInsulation resistance: ≥1000ΜΩ Idaabobo olubasọrọ: ≤30mΩLife:
Asopọ kaadi SIM, PUSH PUSH, 8P+1P, H1.9mm, pẹlu Ifiweranṣẹ KLS1-SIM-108
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 8P + 1P, H1.9mm, pẹlu Ohun elo Ifiweranṣẹ: Ile: Hi-Temp Plastic, UL94V-0.Rated. Olubasọrọ: Alloy Ejò. Ikarahun: Alloy Ejò. Pipa: Agbegbe Olubasọrọ: Filaṣi goolu. Agbegbe solder: 80u" min, Matte tin alloy plated. Labẹ awo: 30u" min, Nickel. Ikarahun:30u" min,Nickel palara agbegbe Solder:Gole filasi. Itanna: Rating lọwọlọwọ:0.5A. Ifarada Foliteji:AC500V rms Insulation Resistance:1000MΩMin,Ni DC 500V ...
Asopọ kaadi SIM, PUSH PUSH, 6P+1P, H1.9mm, pẹlu Ifiweranṣẹ KLS1-SIM-107
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 6P + 1P, H1.9mm, pẹlu Ohun elo Ifiweranṣẹ: Ile: Hi-Temp Plastic, UL94V-0.Rated. Olubasọrọ: Alloy Ejò. Ikarahun: Ejò Alloy/Irin. Pipa: Agbegbe Olubasọrọ: Filaṣi goolu. Agbegbe solder: 80u" min, Matte tin alloy plated. Labẹ awo: 30u" min, Nickel. Ikarahun:30u" min,Nickel palara gbogbo agbegbe Solder:Gole filasi. Itanna: Rating lọwọlọwọ:0.5A. Ifarada Foliteji:AC500V rms Insulation Resistance:1000MΩMin,Ni...
Asopọ kaadi SIM;PUSH PUSH,6P,H1.85mm KLS1-SIM-106
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH,6P,H1.85mm,pẹlu Ile ifiweranṣẹ:Hi-Temp Plastic,UL94V-0.Rated. Olubasọrọ: Alloy Ejò. Ikarahun: SUS. Ipari: Ti ṣe awo goolu lori agbegbe conatct, Tin palara lori awọn iru ti o ta. Abala No. Apejuwe PCS/CTN GW (KG) CMB (m3) OrderQty. Akoko Bere fun
Asopọ kaadi SIM, PUSH PUSH, 6P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-087
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH,6P,H1.85mm,laisi Ohun elo Ifiweranṣẹ: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò,T=0.15mm Shell:Stainless Steel,T=0.15mm Pari: Terminal:50u"min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Itanna: Rating lọwọlọwọ: 0.5A. Iwọn Foliteji: 5.0 Vrms. Idabobo koju...
Asopọ kaadi SIM, PUSH PUSH, 6P+2P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-086
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 6P + 2P, H1.85mm, laisi Ohun elo Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò, T = 0.15mm Ikarahun: Irin Alagbara, T = 0.15mm Pari: Terminal: 50u" min Nickel Underplated on Allover,GoldPlating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flash onSolder Latch. Itanna: Rating lọwọlọwọ:0.5A. Iwọn Foliteji: 5.0 Vrms. Resis Insulation...
Asopọ kaadi SIM, PUSH PUSH, 8P+2P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-085A
Alaye ọja Asopọ kaadi SIM, PUSH PUSH, 8P + 2P, H1.85mm, laisi Ohun elo Post: Insulator:H-TemperaturePlastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò,T=0.15mm Shell:Stainless Steel,T=0.15mm Pari: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u"Nickel Underplated on Allover,GoldFlash on Solder Latch. Itanna: Rating lọwọlọwọ: 0.5A. Iwọn foliteji: 5.0 Vrms. Idabobo koju...
Asopọ kaadi SIM, PUSH PUSH, 8P+2P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-085
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 8P + 2P, H1.85mm, laisi Ohun elo Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,GoldFlash on Solder Latch. Itanna: Rating lọwọlọwọ: 0.5A. Iwọn Foliteji: 5.0 Vrms. Resi idabobo...
Asopọ kaadi SIM, PUSH PUSH, 6P+2P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-084
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 6P + 2P, H1.85mm, laisi Ohun elo Ifiweranṣẹ: Ile: LCP, UL94V-0 Olubasọrọ:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester.Filaṣi Isẹ Kan: -45º Kan Agbegbe Olubasọrọ;Filaṣi goolu Ti a Bo Lori Awọn Tails,Pẹlu Gbogbo Olubasọrọ Underplated 50u" min Nickel. Shell:50u" min Nickel Underplated Overall,Filaṣi goolu Ti a Bo Lori Awọn iru Solder. Apakan No. Apejuwe PC...
Asopọ kaadi SIM, PUSH PUSH, 8P+1P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-074B
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 8P + 1P, H1.85mm, laisi Ohun elo Ifiweranṣẹ: Ibugbe: Iwọn otutu otutu, UL94V-0.Black. Olubasọrọ: Alloy Ejò. Ideri: Olubasọrọ: Alloys Ejò Tabi Irin. Plating: Underplate:Nickel. Agbegbe Olubasọrọ:Gold Over Nickel. Agbegbe Solder: Tin Over Nickel. Ikarahun:G/F Awo Lori Nickel Lori Awọn iru Solder Electrical: Rating lọwọlọwọ: 0.5A. Iwọn Foliteji: 5.0 Vrms. Idabobo Resistance: 500M Min.At DC 500V DC Diduro Foliteji: 250V A...
Asopọ kaadi SIM, PUSH PUSH, 8P+1P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-074A
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 8P + 1P, H1.85mm, laisi Ohun elo Post: Insulator:H-TemperaturePlastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò,T=0.15mm Shell:Stainless Steel,T=0.15mm Pari: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u"Nickel Underplated on Allover,GoldFlash on Solder Latch. Itanna: Rating lọwọlọwọ: 0.5A. Iwọn Foliteji: 5.0 Vrms. Idabobo Resistanc...
Asopọ kaadi SIM, PUSH PUSH, 6P, H1.85mm, pẹlu Ifiweranṣẹ ati ita Post KLS1-SIM-073A
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH,6P,H1.85mm,pẹlu Ifiweranṣẹ ati ita Itanna Itanna: Rating lọwọlọwọ:0.5A. Iwọn Foliteji: 5.0 Vrms. Idabobo Resistance: 500M Min.At DC 500V DC Ifarada Foliteji: 250V ACrms Fun 1 iseju. Olubasọrọ Resistance:100M Max.At 10MA/20mVMAX. Iwọn otutu ti nṣiṣẹ: -45ºC~+85ºCMatingCycles:5000 Awọn ifibọ. Ohun elo: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò, T = 0.15mm Shell: Irin Alagbara, T = 0.15 ...
Asopọ kaadi SIM, PUSH PUSH, 6P+2P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-064A
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 6P + 2P, H1.85mm, laisi Ohun elo Post: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò,T=0.15mm Shell:Stainless Steel,T=0.15mm Pari: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flashon Solder Latch. Itanna: Rating lọwọlọwọ:0.5A. Iwọn Foliteji: 5.0 Vrms. Idabobo koju...
Asopọ kaadi SIM, PUSH PUSH, 6P+2P, H1.80mm, laisi Ifiweranṣẹ KLS1-SIM-030C
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 6P + 2P, H1.80mm, laisi Ohun elo Ifiweranṣẹ: Ile: LCP, UL94V-0 Olubasọrọ:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester. Ipari: Olubasọrọ:Filaṣi goolu Ti a Bo Lori Agbegbe Olubasọrọ;Filaṣi goolu Ti a Bo Lori SolderTails,Pẹlu Gbogbo OlubasọrọUnderplated 50u" min Nickel. Shell:50u" min Nickel Underplated Overall,GoldFlash Plated On Solder Tails.Iwọn otutu ti nṣiṣẹ: -45ºC~+85ºC Apakan No. Apejuwe
Asopọ kaadi SIM, PUSH PUSH, 6P+2P, H1.85mm, pẹlu Post KLS1-SIM-030D
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 6P + 2P, H1.85mm, pẹlu Ohun elo Ifiweranṣẹ: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò, T = 0.15mm; Shell: Irin Alagbara, T = 0.15mm Pari: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flash on Solder Latch. Itanna: Rating lọwọlọwọ:0.5AVoltage Rating:5.0 Vrms. Idabobo Resistance...
Asopọ kaadi SIM, PUSH PUSH, 6P+2P, H1.85mm, pẹlu Ifiweranṣẹ KLS1-SIM-030F
Alaye Ọja Asopọ kaadi SIM, PUSH PUSH, 6P + 2P, H1.85mm, pẹlu Ohun elo Ifiweranṣẹ: Insulator:H-Temperature Plastic,UL94V-0.Black. Olubasọrọ: Alloy Ejò, T = 0.15mm; Shell: Irin Alagbara, T = 0.15mm Pari: Terminal: 50u" min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u"Nickel Underplated on Allover,Gold Flash on Solder Latch. Itanna: Rating lọwọlọwọ:0.5AVoltage Rating:5.0 Vrms. Idabobo Resistance...
Asopọ kaadi SIM, PUSH PUSH, 6P, H1.85mm, laisi Ifiweranṣẹ KLS1-SIM-030E
Alaye ọja Asopọ kaadi SIM, PUSH PUSH, 6P, H1.85mm, laisi Ohun elo Ifiweranṣẹ: Ile: Hi-Temp Plastic, UL94V-0.Rated. Olubasọrọ: Alloy Ejò. Ikarahun: Irin Alagbara.SUS 301,T=0.20mm. Plating: Contact area:G/F Plated over 30u"Nickel Solder area:80u"Tin Plated over 30u"Nickel.Labẹ awo:30u"min Nickel. Shell:30u" min,Nickel Palara Lori Gbogbo,SolderAgbegbe:Gold Filaṣi. Itanna: Rating lọwọlọwọ:0.5 A Dielectric Withstanding Voltage:250...- English
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