Alaye ọja Alaye Asopọ kaadi SIM Micro SIM,6P+1P Pẹlu Yipada,PUSH PUSH,H1.29mm Ohun elo:Housing:High Temperature Thermoplastic,UL94V-0 Contact:Copper Alloy,Au 1u”,Solder area:Gold Flash;Under Over plate Ni 40u” Min all over Shell:SUS0 Itanna: Rating lọwọlọwọ: 0.5A Foliteji Rating: 50V DC Max Resistance:100mΩ Max
Ọja Awọn aworan Alaye Ọja Micro SIM Kaadi Asopọmọra,8P+2P,PUSH PUSH,H1.28mm Ohun elo: Insulator:High Temperature Thermoplastic,UL94V-0,Black. Olubasọrọ: Alloy Ejò.Gold tabi Nickel. Ikarahun:Stainless.Gold tabi Nickel. Agbegbe Solder: Matte Tin 80u” Plated'Gold Flash
Nano SIM Kaadi Asopọmọ,PUSH PUSH,6Pin,H1.25mm,pẹlu CD Pin KLS1-SIM-103
Alaye ọja Alaye Nano SIM Kaadi Asopọmọra,PUSH PUSH,6Pin,H1.25mm,pẹlu CD Pin Ohun elo: Olubasọrọ:Ejò Alloy.Au lori Ni. Ibugbe: Gilasi Kun LCP. Shell:Stainless.Au lori Ni.GND Frame:Copper Alloy.Au lori Ni. Yipada Iwari: Alloy Ejò.Au lori Ni.Slide: Gilasi Fikun Pa10t. Orisun omi: Alagbara. Hook: Alagbara. Itanna: Ti a ṣe iwọn lọwọlọwọ: 0.5A Iwọn foliteji ti o pọju: 30V AC Resistance Olubasọrọ:100mΩ O pọju. Idabobo Resistance:1000MΩ Min./500VDC Dielectric Iduroṣinṣin Foliteji:500...
Ọja Awọn aworan Alaye Ọja Nano SIM Kaadi Asopọmọra;MID Mount Tray type,6Pin,H1.5mm,Pẹlu CD Pin Ohun elo: Plastics:LCP,UL94V-0.Black. Olubasọrọ: C5210 Shell: SUS304 Tray: LCP, UL94V-0.Black. Plating: Contact: Contact Area:G/F Plating;Soldertail Area:80u” Matte Tin Shell:Plating over 30u”Ni Solderable 30u”Ni Plating over all.Contact and tail coplanarity to be 0.10mm all.
Nano SIM Kaadi Asopọmọ, 6Pin,H1.4mm,Hinged Iru,pẹlu CD Pin KLS1-SIM-101
Ọja Awọn aworan Alaye Ọja Nano SIM Kaadi Asopọmọra, 6Pin, H1.4mm,Hinged Iru,pẹlu CD Pin Ohun elo: Ile:High Temperature Thermoplastic,UL94V-0.Black. Terminal: Alloy Ejò, Wura ti a fi palẹ lori agbegbe olubasọrọ ati awọn iru tita, Nickel ti ko ni isalẹ lori gbogbo. Ikarahun: Irin Alagbara, Wura ti a fi si ori awọn iru ti o ta, Nickel ti a ko ni abẹlẹ lori gbogbo rẹ. Itanna: Ti a ṣe iwọn lọwọlọwọ: 0.5A Iwọn foliteji ti o pọju: 30V AC Resistance Olubasọrọ:100mΩ O pọju. Idaabobo Idabobo:1000MΩ Min./500V DC Dielectric Withsta...
Nano SIM Kaadi Asopọmọ, 6Pin,H1.4mm,Hinged Iru,pẹlu CD Pin KLS1-SIM-077A
Alaye Awọn aworan Ọja Nano SIM Kaadi Asopọmọra, 6Pin,H1.4mm,Hinged Iru,pẹlu CD Pin Ohun elo: Insulator:High Temperature Thermoplastic,UL94V-0. Olubasọrọ: Alloy Ejò,Plated 50u” Ni Iwoye Kan si Gbogbo Au 1U. Shell:SUS.All Ni 30U MIN. Itanna: Rating lọwọlọwọ: 0.5A AC/DC MAX Min./100V DC Awọn iyipo ibarasun: Awọn ifibọ 5000 Awọn iwọn otutu: -45ºC~+85...
Nano SIM Kaadi Asopọmọ,PUSH PULL,6Pin,H1.4mm,pẹlu CD Pin KLS1-SIM-092
Alaye ọja Alaye Nano SIM Kaadi Asopọmọra,PUSH PULL,6Pin,H1.4mm,pẹlu CD Pin Ohun elo: Ile:Hi-Temperature Thermoplastic,UL94V-0.Black. Ebute: Alloy Ejò,ayan 1u” Au lori agbegbe olubasọrọ. Ikarahun: Irin alagbara.Selective Gold Flash on solder area. Electrical: Rated current:0.5A Max Rated Voltage:30V AC Resistance:100mΩ Max Igbara: Awọn iyipo iṣẹ 5000.
Ọja Awọn aworan Alaye Ọja Ohun elo: Ile: High Temp.Thermoplastic,UL94V-0.Black Contact:Copper Alloy 0.10T,Gold Flash On Contact Area and Solder Area 50U" Min Nickel Under-Plated Shell:Stainless Steel 0.10T,Nickel Plating Over ALL Rasistance:1.0 Idabobo Idabobo:500MΩ Min Dielectric Pẹlu Diduro Foliteji: 500V RMS Igbeyewo Igbesi aye Min: Awọn iyipo 1500