Alaye ọja Alaye Asopọ kaadi SIM Micro SIM,6P+1P Pẹlu Yipada,PUSH PUSH,H1.29mm Ohun elo:Housing:High Temperature Thermoplastic,UL94V-0 Contact:Copper Alloy,Au 1u”,Solder area:Gold Flash;Under Over plate Ni 40u” Min all over Shell:SUS0 Itanna: Rating lọwọlọwọ: 0.5A Foliteji Rating: 50V DC Max Resistance:100mΩ Max
Ọja Awọn aworan Alaye Ọja Micro SIM Kaadi Asopọmọra,8P+2P,PUSH PUSH,H1.28mm Ohun elo: Insulator:High Temperature Thermoplastic,UL94V-0,Black. Olubasọrọ: Alloy Ejò.Gold tabi Nickel. Ikarahun:Stainless.Gold tabi Nickel. Agbegbe Solder: Matte Tin 80u” Plated'Gold Flash