Micro SD kaadi asopo Hinged Iru, H1.9mm KLS1-TF-017
Ọja Awọn aworan Alaye Ọja Micro SD kaadi asopọ Hinged Iru, H1.9mm Ohun elo: Insulator: Ga otutu Thermoplastic Flammability Raring,UL94V-0, Black. Olubasọrọ: Copper Alloys Ideri: Irin Ailokun Olubasọrọ Agbegbe Plating: Gold voer Ni Solder Tail Coplanarity Gbọdọ wa Laarin 0.10MAX.
Titari asopo kaadi kaadi Micro SD, H1.4mm, pẹlu pin CD KLS1-TF-016
Ọja Awọn aworan Alaye ọja Micro SD kaadi titari titari,H1.4mm,pẹlu CD pin awọn akọsilẹ: 1.Coplanarity spec.fun gbogbo solder ga ati solder pad jẹ 0.10mm 2.Electric abuda: 2-1.Current Rating:0.5 Amp.max. 2-2.Voltage: 100V DC max. 2-3.Low ipele conatct resistance: 100mΩ Max. 2-4.Dielectric Withstanding Voltage: AC500V rms. 2-5.Insulation Resistance: 1000MΩ Min. (Ipari) 100MΩ Min. 3.Mechanical abuda: 3-1.Durability: 5000 Cycles. 3-2.Iwọn otutu ti nṣiṣẹ: -45ºC~+105ºC ...
Micro SD kaadi titari titari asopo,H1.42mm,pẹlu CD pin KLS1-TF-015
Ọja Awọn aworan Alaye Ọja Micro SD kaadi asopo titari fa,H1.42mm,pẹlu CD pin ohun elo: Irin ikarahun: Irin alagbara, irin,Nickel ìwò 50u"Housing:Liouid crystal polymer,UL94V-0，Black. Kan si ebute:Phosphor Bronze.Contact:Gold flash;Solder Tail:Gold.1u" Wa Terminal:Phosphor Bronze.Contact:Gold flash;Solder Iru:Gold 1u” Min. Yipada Terminal:Phosphor Bronze.Contact:Gold flash;Solder Iru:Gold 1u”min.
Micro SD kaadi asopo ohun titari fa,H1.8mm KLS1-TF-014
Alaye ọja Alaye Micro SD kaadi titari titari, Giga 1.8mm, Roll Pack. Ohun elo: Ibugbe: LCP, UL94V-0, Dudu. Ipari: Alloy Ejò, Wura Yiyan Lori Agbegbe ibarasun. Ikarahun: Itanna Irin: Iwọn Foliteji: 5V Iwọn lọwọlọwọ: 0.5 A Max. Olubasọrọ Resistance:100mΩ O pọju. Idaabobo Idaabobo: 1000MΩ Min. Ifarada Foliteji: 500V 1 Iṣẹju. Agbara: 10000 Awọn iyipo.
Titari asopo kaadi SD kaadi Micro,H1.4mm,pẹlu pin CD KLS1-TF-012
Ọja Awọn aworan Alaye Ọja Micro SD kaadi titari titari,H1.4mm,pẹlu CD pin Ohun elo: Insulator:High Temperature Thermoplastic,UL94V-0. Terminal: Alloy Ejò,Plated 50u”Ni Iwoye.Plated Au Selective Contact Area Palara 100u”Sn Over Ni On Solder Area. Ikarahun:Plated 50u” Ni Iwoye. Plated Au Selective Contact Area Electrical: Rating lọwọlọwọ: 0.5 A AC/DC max. Iwọn foliteji:125V AC/DC Ibaramu Ọriniinitutu: 95% RH Max. Olubasọrọ Resistance:100mΩ Max. Ins...
Asopọmọra Kaadi SD Micro;Iru Irọri,H1.5mm & H1.8mm KLS1-TF-007
Ọja Awọn aworan Alaye Ọja Micro SD Kaadi Asopọmọra;Hinged Iru,H1.5mm & H1.8mm Ohun elo: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal:Ejò Alloy.AU Plating lori gbogbo agbegbe olubasọrọ ebute, ati tin plating lori agbegbe iru solder. Ikarahun: Irin alagbara. Itanna: Iwọn lọwọlọwọ: 0.5 Iwọn Foliteji kan: 5.0 vrms Idabobo Resistance: 1000MΩ Min./500V DC Diduro Foliteji: 250V AC Fun iṣẹju kan. Olubasọrọ Resistance: 100mΩ Max.AT 10mA/20mV Iwọn Iṣiṣẹ ti o pọju: -45ºC~...
Mid Mount Micro SD kaadi titari titari, H1.8mm, fibọ pẹlu CD pin KLS1-TF-003E
Ọja Awọn aworan Alaye Ọja Mid Mount Micro SD kaadi titari titari asopo,H1.8mm,fibọ pẹlu CD pin Ohun elo: Ile:High Temperature Thermoplastic,UL94V-0，Black. Ibudo: Alloy Ejò . Ikarahun: Irin alagbara. Olubasọrọ:Agbegbe Olubasọrọ:Au G/F,Agbegbe Solder:Matte tin 80u" Min;Labẹ awo Ni 30u" Min gbogbo. Pin CD:Agbegbe Olubasọrọ:Au G/F,Labẹ awo Ni 30u” Min gbogbo. Itanna: Ti a ṣe iwọn lọwọlọwọ:1.0 A Rated Voltage:30V Olubasọrọ Resistance50mΩ Max. Idaabobo Resistance:100...
Titari asopo kaadi SD kaadi Micro, H1.85mm, pẹlu pin CD KLS1-TF-003D
Ọja Awọn aworan Alaye Ọja Micro SD kaadi titari titari,H1.85mm,pẹlu CD pin Ohun elo: Insulator:High Temperature Thermoplastic,LCP,UL94V-0. Olubasọrọ:Ejò Alloy T=0.15,Plated 50u”Ni ìwò.Plated Au Selective Contact Area Palara 30u”-70u”Sn Over Ni On Solder Area.Ikarahun:T=0.15,Plated 30u”Ni ìwò min. Palara 0.5u” Au Selective ContactArea Electrical: Rating lọwọlọwọ: 0.5mA amx. Iwọn Foliteji: 3.3V Ibaramu Ọriniinitutu Ibiti: 95% RH Max. Co...
Titari asopo kaadi SD kaadi Micro,H1.85mm,pẹlu pin CD,GOLD KLS1-TF-003C
Ọja Awọn aworan Alaye ọja Micro SD kaadi titari titari,H1.85mm,pẹlu CD pin,GOLD Ohun elo: Insulator:High Temperature Thermoplastic,LCP,UL94V-0. Olubasọrọ:Ejò Alloy T=0.15,Plated 50u”Ni ìwò.Plated Au Selective Contact Area Palara 30u”-70u”Sn Over Ni On Solder Area.Ikarahun:T=0.15,Plated 30u”Ni ìwò min. Palara 0.5u”Agbegbe Olubasọrọ yiyan. Itanna: Rating lọwọlọwọ: 0.5mA AC/DC amx. Iwọn foliteji: 125V AC/DC Ọriniinitutu Ibaramu Ran...
Mid Mount Micro SD kaadi titari titari, H1.8mm, pẹlu CD pin KLS1-TF-003A
Ọja Awọn aworan Alaye Ọja Mid Mount Micro SD kaadi asopo titari titari,H1.8mm,pẹlu CD pin Ohun elo: Insulator:High Temperature Thermoplastic,UL94V-0. Olubasọrọ: Alloy Ejò, Palara 50u” Ni Iwoye. Plated Au Selective Contact Area Palara 100u” Sn Over Ni On Solder Area. Ikarahun: Palara 50u” Ni Iwoye. Palara 1u”Agbegbe Olubasọrọ yiyan. Itanna: Rating lọwọlọwọ: 0.5mA AC/DC amx. Iwọn Foliteji: 125V AC/DC Iwọn Ọriniinitutu Ibaramu: 95% RH Max. Kan si Resi...
Titari asopo kaadi kaadi Micro SD, H1.85mm, pẹlu pin CD KLS1-TF-003
Ọja Awọn aworan Alaye Ọja Micro SD kaadi titari titari,H1.85mm,pẹlu CD pin Ohun elo: Insulator:High Temperature Thermoplastic,UL94V-0. Olubasọrọ:Ejò Alloy T=0.15,Plated 50u”Ni ìwò.Plated Au Selective Contact Area Palara 30u”-70u”Sn Over Ni On Solder Area.Ikarahun:T=0.15,Plated 30u”Ni ìwò min. Palara 0.5u” Au Yiyan Agbegbe Olubasọrọ Itanna: Iwọn lọwọlọwọ lọwọlọwọ: 0.5 Iwọn Foliteji kan: 3.3V Iwọn ọriniinitutu Ibaramu: 95% RH Max. Kan si Tun...
Asopọmọra Kaadi SD Micro;Hinged Iru,H1.9mm KLS1-TF-002
Awọn aworan Alaye Ọja Asopọmọra Kaadi Micro SD; Iru Hinged, H1.9mm Ohun elo: Ohun elo Ile: LCP UL94V-0 Ohun elo Olubasọrọ: Tin-Bronze Package: Teepu ati Reel Package Electrical Characteristics: Foliteji Rating: 100V AC Lọwọlọwọ Rating: 0.5V / AC1 resistance: Max 0. ≥1000ΜΩ Idaabobo olubasọrọ: ≤30MΩ Igbesi aye: 5000 Awọn iwọn otutu Ṣiṣẹpọ: -45ºC ~+105ºC
Titari asopo kaadi kaadi Micro SD, H1.85mm, Titiipa deede KLS1-TF-001B
Awọn aworan Ọja Alaye Ọja Micro SD kaadi titari titari asopo,H1.85mm, Ohun elo ti a ti pa ni deede: Ile: LCP, UL94V-0, Dudu. Olubasọrọ:Phosphor Bronze. Ikarahun: SUS304. Itanna: Olubasọrọ Resistance:100mΩ O pọju. Dielectric Withstanding Foliteji: 500V AC Max pẹlu 1 Iṣẹju. Idaabobo Idaabobo: 1000MΩ Min. Iwọn lọwọlọwọ: 0.5mA AC/DC max. Iwọn Foliteji: 100V RMS Min. Agbara ibarasun: 13.8N Max. Agbara Unmating: 13.8N Min. Olubasọrọ Resistance Force:100g Min.Per Pin. Iwọn otutu ti nṣiṣẹ: -45ºC~+...
Titari asopo kaadi kaadi Micro SD, H1.85mm, Titiipa deede KLS1-TF-001
Awọn aworan Ọja Alaye Ọja Micro SD kaadi titari titari asopo,H1.85mm, Ohun elo ti a ti pa ni deede: Ile:Iwọn otutu otutu, UL94V-0, dudu. Olubasọrọ: Alloy Ejò. Ikarahun: Irin alagbara, Nickle. Lever: Irin alagbara, Nickle. Orisun omi: Pianowire, Nickle. Plating: Underplate:Nickel. Agbegbe Olubasọrọ:Gold over Nickel. Agbegbe Solder: Tin lori nickel.
Asopọ kaadi SIM meji, Titari PULL, H3.0mm KLS1-SIM2-002A
Alaye Awọn aworan Ọja Asopọ kaadi SIM meji, PUSH PULL, H3.0mm Ohun elo: Ile: Hi-TEMP Plastic, UL94V-0.Black. Ikarahun: Ejò alloy Shell: Irin alagbara, irin Pari: Terminal: Au Palara lori agbegbe olubasọrọ , Matte tin palara lori awọn iru solder labẹ nickel Shell: Au Plated lori awọn iru solder underplated lori nickel Electrical: Kan si Resistance: 50mΩ Max Withstanding Voltage:350V ACΩ resistance: 350V ACΩ resistance ...
2 Ninu 1 Micro SIM & Asopọ kaadi SD, 8P, H2.26mm KLS1-SIM-109
Ọja Awọn aworan Alaye Ọja 2 Ni 1 Micro SIM & Asopọ kaadi SD, 8P, H2.26mm Ohun elo: Insulator: High Temp Thermoplastic, UL94V-0.Black. ebute: Alloy Ejò,Gold Plating in contact area 1u”,Soldering Area gilding 1u”Upper Shell:Stainless Steel,Plate Nickel 50u” Down Shell:SUS304 R-1/2H T=0.10mm,Plate Nickel 50u”. Itanna: Agbara ifibọ 1kgf Max.Iyọkuro Agbara 0.1kgf Min. Agbara: Awọn iyipo SIM 5000, Resistance Olubasọrọ: Ṣaaju idanwo 80mΩ Max, Lẹhin...
Asopọ kaadi SIM ilọpo meji, Titari FA, H3.0mm KLS1-SIM-033
Alaye Awọn aworan Ọja Asopọ kaadi SIM meji, PUSH PULL, H3.0mm Ohun elo: Ile: Hi-Temperature Plastic, UL94V-0.Black. Terminal:Copper Alloy.Gold Flash Palara Lori Gbogbo Terminal,Ati 50u” min Nickel Underplated Lori Allover. Ikarahun: Irin Alagbara.50u” Nickel Underplated Lori Allover,Gold Flash Lori Solder PAD. Itanna: Iwọn lọwọlọwọ: 0.5 A. Iwọn Foliteji: 5.0 vrms. Idabobo Resistance:1000MΩ Min.At DC500V DC. Ifarada Foliteji: 250V AC RMS Fun Iṣẹju 1. Olubasọrọ...
2 Ninu 1 SIM Kaadi + Asopọ Micro SD, Titari PULL, H2.7mm KLS1-SIM-024
Alaye Awọn aworan Ọja 2 Ni 1 SIM Kaadi + Asopọ Micro SD, Titari PULL, H2.7mm Itanna: Foliteji: 100V AC Lọwọlọwọ: 0.5A Max. Olubasọrọ Resistance:100mΩ O pọju. Dielectric Ifarada Foliteji: 500V AC. Idabobo Resistance:1000MΩ Min Mechanical: Ifi sii Kaadi Agbara yiyọ kuro:13.8N Max. Titari Ni Agbara: 19.6N Max. Agbara: 10000 Awọn iyipo. Awọn iwọn otutu ti nṣiṣẹ: -45ºC~+85ºC Itanna: Foliteji: 100V AC Lọwọlọwọ: 0.5A Max. Olubasọrọ Resistance:100mΩ O pọju. Dielectric Duro...
Nano SIM Kaadi Asopọmọ; Titari PULL, 6Pin, H1.40mm KLS1-SIM-113
Alaye Awọn aworan Ọja Nano Asopọ kaadi SIM;PUSH PULL,6Pin,H1.40mm Ohun elo: Insulator:LCP,UL94V-0. Olubasọrọ:C5210.Plated 50u”Ni ìwò,Kan si Gbogbo Au 1u. Shell:SUS,Plated 50u”Ni ìwò,PAD Au 1u. Itanna: Iwọn lọwọlọwọ: 0.5A AC/DC max. Iwọn Foliteji:30V AC/DC Resistance Olubasọrọ:30mΩ O pọju. Atako Idabobo:1000MΩ Min Iwọn Iṣiṣẹ: -45ºC~+85ºC
Nano SIM Kaadi Asopọmọ,PUSH PUSH,6Pin,H1.37mm,pẹlu CD Pin KLS1-SIM-066
Alaye ọja Alaye Nano SIM Kaadi Asopọmọra,PUSH PUSH,6Pin,H1.37mm,pẹlu CD Pin Ohun elo: Insulator:High Temperature Thermoplastic,UL94V-0. Olubasọrọ: Alloy Ejò, Palara 50u” Ni Iwoye, PAD Au 1u”. Shell:SUS.Gbogbo Ni 30U/MIN. Itanna: Iwọn lọwọlọwọ: 0.5A ampers Foliteji Rating: 5V AC/DC Resistance Olubasọrọ:100mΩ Max. Idaabobo Idabobo:1000MΩ Min./500V DC Iwọn otutu Ṣiṣẹ: -45ºC~+85ºC
Nano SIM Kaadi Asopọmọ,PUSH PUSH,6Pin,H1.25mm,pẹlu CD Pin KLS1-SIM-103
Alaye ọja Alaye Nano SIM Kaadi Asopọmọra,PUSH PUSH,6Pin,H1.25mm,pẹlu CD Pin Ohun elo: Olubasọrọ:Ejò Alloy.Au lori Ni. Ibugbe: Gilasi Kun LCP. Shell:Stainless.Au lori Ni.GND Frame:Copper Alloy.Au lori Ni. Yipada Iwari: Alloy Ejò.Au lori Ni.Slide: Gilasi Fikun Pa10t. Orisun omi: Alagbara. Hook: Alagbara. Itanna: Ti a ṣe iwọn lọwọlọwọ: 0.5A Iwọn foliteji ti o pọju: 30V AC Resistance Olubasọrọ:100mΩ O pọju. Idabobo Resistance:1000MΩ Min./500VDC Dielectric Iduroṣinṣin Foliteji:500...
Nano SIM Kaadi Asopọmọ, Iru atẹ, 6Pin, H1.55mm, pẹlu CD Pin KLS1-SIM-104
Alaye ọja Alaye Nano SIM Kaadi Asopọmọra,Tray Iru, 6Pin,H1.55mm,pẹlu CD Pin Electrical: Lọwọlọwọ Rating:1 Amp/Pin.MAX. Foliteji:30V DC.MAX Atako Olubasọrọ Ipele Kekere:30mΩ Max. Ni ibẹrẹ. Dielectric Withstanding Voltage: 500V AC MIN.Fun 1 iṣẹju. Idabobo Resistance:100MΩ Min.500V DC .Fun 1 iseju. Agbara: 1500 Awọn iyipo. Iwọn otutu ti nṣiṣẹ: -45ºC~+85ºC
Nano SIM Kaadi Asopọmọ, Iru atẹ, 6Pin, H1.5mm, pẹlu CD Pin KLS1-SIM-102
Alaye ọja Awọn aworan Nano Asopọ kaadi SIM, Iru atẹ, 6Pin, H1.5mm,pẹlu CD Pin Electrical: Rating lọwọlọwọ: 1 Amp/Pin.MAX. Foliteji:30V DC.MAX Atako Olubasọrọ Ipele Kekere:30mΩ Max. Ni ibẹrẹ. Dielectric Withstanding Voltage: 500V AC MIN.Fun 1 iṣẹju. Idabobo Resistance:100MΩ Min.500V DC .Fun 1 iseju. Agbara: 1000 Awọn iyipo. Iwọn otutu ti nṣiṣẹ: -45ºC~+85ºC
Nano SIM Kaadi Asopọmọ;MID Oke Tray Iru, 6Pin,H1.5mm,pẹlu CD Pin KLS1-SIM-100
Ọja Awọn aworan Alaye Ọja Nano SIM Kaadi Asopọmọra;MID Mount Tray type,6Pin,H1.5mm,Pẹlu CD Pin Ohun elo: Plastics:LCP,UL94V-0.Black. Olubasọrọ: C5210 Shell: SUS304 Tray: LCP, UL94V-0.Black. Plating: Contact: Contact Area:G/F Plating;Soldertail Area:80u” Matte Tin Shell:Plating over 30u”Ni Solderable 30u”Ni Plating over all.Contact and tail coplanarity to be 0.10mm all.- English
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