Awọn aworan ọja
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ọja Alaye
pogo pin itele mimọ iru
APO:
Olopobobo: aluminiomu bankanje apo.
Reli: opin Φ330mm; ti ngbe teepu iwọn: 12, 16, 24, 32, 44mm.
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Itanna išẹ | ||||
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1 | Olubasọrọ ikọjujasi | 30 mohm Max ni ṣiṣẹ ọpọlọ | Iwọn idanwo ile-iṣẹ Top-Link* | |
2 | Idabobo Resistance | 500 Mohm Min | EIA-364-21 | |
3 | Dielectric Withstanding Foliteji | Ko si filasi-lori, itujade afẹfẹ, didenukole tabi jijo | EIA-364-20 | |
4 | Iwọn otutu Dide vs Rating lọwọlọwọ | 30 °C ti o pọju. dide otutu ni lọwọlọwọ pato | EIA-364-70 | |
Darí išẹ | ||||
1 | Agbara orisun omi | tọka si iyaworan ọja | EIA-364-04 | |
2 | Agbara idaduro | 0.5Kgf (4.5N) min. | EIA-364-29 | |
3 | Iduroṣinṣin | 10.000 waye Min. Ko si bibajẹ ti ara Resistance lẹhin idanwo 30 mohm Max. | EIA-364-09 | |
4 | Gbigbọn | Ko si ibajẹ ti ara, Ko si idaduro itanna diẹ sii ju iṣẹju 1i lọ. | EIA-364-28 | |
5 | Mechanical mọnamọna | Ko si ibajẹ ti ara, Ko si idaduro itanna diẹ sii ju iṣẹju 1i lọ. | EIA-364-27 ọna A | |
Ayika | ||||
1 | Solderability | agbegbe solder Min.95% | EIA-364-52 | |
2 | Iyọ Sokiri Ipata | Ko si bibajẹ ti ara. Resistance lẹhin idanwo 100 mohm Max. | EIA-364-26 ipo B | |
3 | Atako si ooru Solder (IR/convection) | Ko si awọn dojuijako, awọn eerun igi, yo, orblister | EIA-364-56 | |
4 | Ọriniinitutu | Ko si ibajẹ ti ara, Resistance lẹhin idanwo 100 mohm Max. | EIA-364-31, ọna ii, majemu A | |
5 | Gbona mọnamọna | Ko si ibajẹ ti ara, Resistance lẹhin idanwo 100 mohm Max. | EIA-364-32,ọna ii | |
6 | Igbesi aye otutu | Ko si ibajẹ ti ara, Resistance lẹhin idanwo 100 mohm Max. | EIA-364-17,Ipo A,Ipo 4 | |
Ayika | ||||
1 | Peeli agbara | 10-130 gf | EIA-481 | |
2 | Idanwo silẹ | Tọkasi lati ju silẹ igbeyewo Standard of Molex |