Awọn aworan Ọja Alaye Ọja CFast Host Connector,H6.05,PUSH PUSH Iru Ohun elo Housing:Ingineering Plastic,LCP pẹlu GF fikun,dudu fun,UL 94V-0,oṣuwọn. Slider: ṣiṣu ẹrọ, LCP pẹlu GF fikun, dudu fun, UL 94V-0, oṣuwọn. Ebute: Phosphor Bronze, fun JIS 5210,0.2T Orisun omi: Piano o tẹle irin ideri: Irin alagbara, irin dì SUS304 0.2T, Crank: Stainless Rod SUS 304. Titiipa kaadi: Irin alagbara SUS 304 Plating Contacts: 30u" goolu plating in contact area and 100 min
Awọn aworan Ọja Alaye Asopọmọra Olugbalejo CFast, Ibugbe Ohun elo SMT inaro: ṣiṣu ẹrọ, LCP pẹlu GF fikun, dudu fun, UL 94V-0, oṣuwọn. Terminal:Phosphor Bronze,fun JIS 5210,0.2T Awọn olubasọrọ Plating:30u"fifun goolu ni agbegbe olubasọrọ ati 100u" min.matte Tin ni agbegbe tita, lori gbogbo olubasọrọ ti o wa labẹ 50u" min, Nickel lori gbogbo. Agbegbe Solder: 100u" matte Tin, 500 nickelu "min.
Ọja Awọn aworan Alaye Ọja CF kaadi Asopọ 50P,L13.75mm,H3.9mm Ohun elo: Housing:Thermoplastic,UL94V-V0.White. Olubasọrọ: Alloy Ejò 0.40T.Gold Filaṣi Lori Agbegbe Olubasọrọ Matte-Tin ti a fi sori iru tita ni gbogbo palara Nickel. Fixing:Copper Alloy 0.30T.Tin palara lori iru solder gbogbo lori Nickel palara. Itanna: Iwọn lọwọlọwọ: 0.5A AC, DC. Olubasọrọ Resistance: 40mΩ O pọju. Idaabobo Idaabobo: 1000MΩ Min. Ifarada Foliteji: 500V AC/iṣẹju Iwọn Iṣiṣẹ: -45ºC~+85ºC
SD 4.0 kaadi asopo KO titari,H3.0mm KLS1-SD4.0-002 & KLS1-SD4.0-002A
Awọn aworan Ọja Alaye Ọja SD 4.0 asopo kaadi KO titari,H3.0mm Ohun elo: Insulator: LCP rated, UL94V-0, Black. Awọn olubasọrọ:Phosphor Bronze.Tin 80u” Min ni Solder Tail,Gold ti a yan lori Plating agbegbe olubasọrọ. Ikarahun:Ailagbara,Gold ni Solder Iru,Lori Nickel Plating.itanna: Voltage Ṣiṣẹ:10 VAC Max 500VDC Dielectric Ifarada Foliteji: 500VAC / 1 Iṣẹju: 10000 Cyc ...
Ọja Awọn aworan Alaye Ọja SD 4.0 kaadi titari asopo ohun titari,H3.0mm, Yiyipada Ohun elo: Insulator: LCP won won, UL94V-0, Black. Awọn olubasọrọ:Phosphor Bronze.Tin 80u” Min ni Solder Tail,Gold ti a yan lori Plating agbegbe olubasọrọ. Ikarahun:Ailagbara,Gold ni Solder Iru,Lori Nickel Plating.itanna: Voltage Ṣiṣẹ:10 VAC Max 500VDC Dielectric Iduroṣinṣin Foliteji: 500VAC / 1 Iṣẹju:
Ọja Awọn aworan Alaye Ọja SD kaadi asopo titari fa,H2.5mm Ohun elo: Ile:Hi-Temp ṣiṣu,UL94V-0. Olubasọrọ: Alloy Ejò. Àlàfo: Irin alagbara. Ipari: Olubasọrọ:G/F Gold ti a fi si agbegbe conatct; G/F palara lori solder iru,Base Nickel 50u" Min àlàfo:50u" Nickel Labẹ,100u" Tin Ìwò.
Titari asopo kaadi SD kaadi, H2.75mm, pẹlu CD pin KLS1-SD112
Awọn aworan Ọja Alaye Ọja SD kaadi asopo titari fa,H2.75mm,pẹlu CD pin Ohun elo: Ile:High Temperature Thermoplastic. Olubasọrọ: Alloy Ejò. Ikarahun: Alloy Ejò, Wura ti a fi si ori iru awọn ohun ti a fi n ta, Nickel ti a ko ni abẹlẹ lori gbogbo rẹ. Plating: Agbegbe Olubasọrọ:Gold Palara lori Ni. Solder Iru: 30u" Min Sn Palara Lori Ni
Titari asopo kaadi SD kaadi, H2.8mm, pẹlu CD pin KLS1-SD002
Ọja Awọn aworan Alaye ọja SD kaadi asopo titari fa,H2.8mm,pẹlu CD pin Ohun elo: Housing:LCP,UL94V-0.Black. Ipari: C5191R-EH T=0.20, Kan si G/F, Ni 40u” min, Soldering Tin 80u WP Pin:C5191R-EH T=0.20, Kan si G/F, Ni 40u” min, Soldering Tin 80u CD Pin:C5191R=Ni 40u” min, Soldering Tin 80u Shell:C2680-H,T=0.20,NI 40u” min. Itanna: Olubasọrọ lọwọlọwọ Rating: 0.5Amperes. Dielectric Dielectric Foliteji:AC500V rms. Resistan idabobo...
Awọn aworan Ọja Alaye Ọja Titari asopo kaadi SD kaadi titari,H2.8mm,pẹlu CD pin Ohun elo: Insulator:High Temperature Thermoplastic,UL94V-0. Olubasọrọ:Copper Alloys.Plated 50u” Ni Iwoye Plated Au Selective Contact Area,Plateted 100u” Sn Over Ni On Solder Area. Shell:Plateted 50u”Ni Iwoye
Ọja Awọn aworan Alaye ọja 5 ni 1 Kaadi Asopọmọra,H4.3mm Ohun elo Insulator:Hi-Temperature Plastic,UL94V-0,Awọ:Black Terminal:Copper Alloy,Aayan Gold Flash Plating Lori Agbegbe Olubasọrọ,Ati 50U” Min Nickel Underplated On Allover Shell:Stainless Stell,50GAD Lori Allover Nickel Soll Idabobo idabobo: 1000Μ min.AT DC 500V DC Iduro agbara: 250V ACrms FUN 1 Iṣẹju Olubasọrọ: 100mΩ max.AT 10mA / 20mV max Ratin lọwọlọwọ ...
Micro SD 4.0 kaadi asopo ohun titari KLS1-SD4.0-004
Ọja Images Alaye ọja Micro SD 4.0 kaadi asopo titari titari Ohun elo: Ṣiṣu: LCP, Thermoplastic UL94V-0.Black. Olubasọrọ: Alloy Ejò. Ikarahun: Irin alagbara. Pilating: Agbegbe Olubasọrọ:Au 3u” Lori Ni 50u”. Agbegbe Iru Solder: Matted Tin 80u” Min. Lori Ni 50u”. Solderability: Lori Plating Ni 50″ Ju Gbogbo.
Ọja Awọn aworan Alaye ọja Micro SD kaadi titari titari,H1.28mm,pẹlu CD pin Ohun elo: Insulator:High Temperature Thermoplastic LCP SZ6505,UL94V-0,Black. Olubasọrọ: Berylliun Ejò (7035-TM06,T=0.15mm), Palara 80u" min Ni apapọ palara 1u" min Au lori Ni lori agbegbe tita. Ikarahun: SUS301-3 / 4H T = 0.10mm. Solder iru palara 1u" min Au overll 50u" min Ni. Itanna: Iwọn lọwọlọwọ: 0.5A AC/DC max. Iwọn Foliteji: 12V AC/DC Iwọn Ọriniinitutu Ibaramu: 95% RH Max. ...